IPC CI-408:1994
Solderless Surface Mount Connectors Design Characteristics and Application Guidelines
Association Connecting Electronics Industries , 01/01/1994
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Provides information on design characteristics and the application of solderless surface mount connectors, including conductive adhesives, in order to aid IC package to board interconnection.
Product Information
Published:
01/01/1994
Pages:
46
File Size:
1 file , 550 KB
Language:
English
Note:
This product is unavailable in Russia, Ukraine, Belarus
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