IPC 9301:2018
Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability
Association Connecting Electronics Industries , 12/01/2018
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The IPC/JEDEC-9301document is an effort to standardize and document some of the basic tenets of a typical Finite Element Analysis (FEA) model, as well as, to educate new designers (and in some cases even experienced designers) on the basic information and best practices that should be captured and provided to technical reviewers of the results of FEA data.
Product Information
Published:
12/01/2018
Pages:
92
ISBN:
9781611934342
File Size:
1 file , 7.4 MB
Language:
English
Note:
This product is unavailable in Russia, Ukraine, Belarus
