IPC 4555:2022
Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards
Association Connecting Electronics Industries , 04/01/2022
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IPC 4555 PDF
This performance specification sets requirements for High Temperature Organic Solderability Preservatives (OSP-High Temperature) for Pb-free soldering. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) and original equipment manufacturers (OEM).
Product Information
Published:
04/01/2022
Pages:
24
ISBN:
9781638160748
File Size:
1 file , 990 KB
Note:
This product is unavailable in Russia, Ukraine, Belarus
