IPC 4104:1999
Specifications for High Density Interconnect (HDI) and Microvia Materials
Association Connecting Electronics Industries , 05/01/1999
$71.00
$142.00
Covers the various conductive and dielectric materials that can be used for the fabrication of HDI and microvias.The 23 specification sheets included in IPC/JPCA-4104 specify the qualification and conformance requirements for such materials as photoimageable dielectric dry films and liquids, epoxy blends and coated foils. IPC/JPCA-4104 also includes six new test methods developed specifically for the testing of HDI and microvia materials.
Product Information
Published:
05/01/1999
Pages:
100
File Size:
1 file , 440 KB
Language:
English
Note:
This product is unavailable in Russia, Ukraine, Belarus
