IEC 63068-4 Ed. 1.0 en:2022
Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 4: Procedure for identifying and evaluating defects using a combined method of optical inspection and photoluminescence
International Electrotechnical Commission , 07/01/2022
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This part of IEC 63068 provides a procedure for identifying and evaluating defects in as-grown 4H-SiC (Silicon Carbide) homoepitaxial wafer by systematically combining two test methods of optical inspection and photoluminescence (PL). Additionally, this document exemplifies optical inspection and PL images to enable the detection and categorization of defects in SiC homoepitaxial wafers.
Product Information
Published:
07/01/2022
Pages:
30
ISBN:
9782832243077
File Size:
1 file , 7.9 MB
Language:
English
Note:
This product is unavailable in Ukraine, Russia, Belarus
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