IEC 63011-2 Ed. 1.0 b:2018
Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect
International Electrotechnical Commission , 11/28/2018
$48.00
$95.00
IEC 63011-2:2018 provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys. These specifications apply only if electrical coupling method of die-to-die alignment is used in the die stacking.
Product Information
Published:
11/28/2018
Pages:
28
File Size:
1 file , 1.5 MB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus
Related Documents
IEC 60471 Ed. 3.0 b:2020
$26.00
IEC 60811-401 Ed. 1.0 b:2012
$73.00
IEC 60456 Ed. 5.0 en:2010
$241.00