IEC 63011-1 Ed. 1.0 b:2018
Integrated circuits - Three dimensional integrated circuits - Part 1: Terminology
International Electrotechnical Commission , 11/28/2018
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IEC 63011-1:2018 provides definitions pertaining to multichip integrated circuits, as vertically stacked dies using through-silicon vias (TSVs) or micro bumps. Terms and definitions related to the fabrication and test of the multichip integrated circuits are also provided.
Product Information
Published:
11/28/2018
Pages:
24
File Size:
1 file , 1.3 MB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus
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