IEC 62878-2-602 Ed. 1.0 b:2021

Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity

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This part of IEC 62878 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules.

Published: 06/01/2021

Pages: 28

ISBN: 9782832298947

File Size: 1 file , 4.9 MB

Language: English, French

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