IEC 62769-8 Ed. 1.0 b:2023
Field device integration (FDI®) – Part 8: EDD to OPC-UA Mapping
International Electrotechnical Commission , 04/01/2023
$184.00
$367.00
This part of IEC 62769 specifies how the internal view of a device model represented by the EDD can be transferred into an external view as an OPC-UA information model by mapping EDD constructs to OPC-UA objects.
Product Information
Published:
04/01/2023
Pages:
110
ISBN:
9782832267929
File Size:
1 file , 2.4 MB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus
Related Documents
IEC 61784-3 Ed. 4.1 en:2024
$445.00
IEC 60318-7 Ed. 1.0 b:2022
$139.00
IEC 60364-5-53 Ed. 3.1 b:2002
$176.00
