IEC 62418 Ed. 1.0 b:2010
Semiconductor devices - Metallization stress void test
International Electrotechnical Commission , 04/22/2010
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IEC 62418:2010 describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization.
Product Information
Published:
04/22/2010
Pages:
34
File Size:
1 file , 990 KB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus
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