IEC 62374-1 Ed. 1.0 b:2010
Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
International Electrotechnical Commission , 09/29/2010
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IEC 62374-1:2010 describes a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices.
Product Information
Published:
09/29/2010
Pages:
32
File Size:
1 file , 490 KB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus
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