IEC 62047-16 Ed. 1.0 b:2015
Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
International Electrotechnical Commission , 03/05/2015
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IEC 62047-16:2015 specifies the test methods to measure the residual stresses of films with thickness in the range of 0,01 μ to 10 μ in MEMS structures fabricated by wafer curvature or cantilever beam deflection methods.
Product Information
Published:
03/05/2015
Pages:
21
File Size:
1 file , 420 KB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus
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