Describes the procedure to monitor changes in attenuation and/or return loss of a component or an interconnecting device, when subjected to an environmental or mechanical test. The procedure may be applied to measurements on single samples or to simultaneous measurements on multiple samples, both at single wavelengths and multiple wavelengths, by using branching devices and/or switches as appropriate.
Product Information
Published:
01/20/2005
Pages:
18
File Size:
1 file , 520 KB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus