IEC 61249-8-8 Ed. 1.0 b:1997
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings
International Electrotechnical Commission , 06/24/1997
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Provides requirements for the qualification of temporary solder resist coatings. Requirements stated in this specification will also have some limited validity for assessing the suitability of printed boards which are supplied with peelable solder masks.
Product Information
Published:
06/24/1997
Pages:
19
File Size:
1 file , 120 KB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus
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