IEC 61192-4 Ed. 1.0 b:2002
Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
International Electrotechnical Commission , 11/29/2002
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Specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally terminals or mixed assemblies that include surface-mounting or other related assembly technologies, for example through-hole, wires.
Product Information
Published:
11/29/2002
Pages:
59
File Size:
1 file , 3.5 MB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus
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