IEC 61192-2 Ed. 1.0 b:2003
Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
International Electrotechnical Commission , 03/14/2003
$176.00
$352.00
Specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. Applies to assemblies that are totally surface-mounted and to the surface-mount portions of assemblies that include other related assembly technologies, for example, through-hole mounting.
Product Information
Published:
03/14/2003
Pages:
127
File Size:
1 file , 5.8 MB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus
Related Documents
IEC 60705 Ed. 4.2 b:2018
$348.00
IEC 62604-1 Ed. 1.0 b:2015
$130.00
IEC 61010-031 Ed. 2.0 b:2015
$196.00
IEC 61120-4 Ed. 1.0 b:1992
$48.00