IEC 61190-1-1 Ed. 1.0 b:2002

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

International Electrotechnical Commission , 03/25/2002

$95.00 $190.00
Specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.

Product Information

Published: 03/25/2002
Pages: 41
File Size: 1 file , 570 KB
Language: English, French
Note: This product is unavailable in Ukraine, Russia, Belarus

Related Documents

IEC 61084-2-1 Ed. 2.1 b:2024
IEC /SRD 63200 Ed. 1.0 en:2021
IEC 62368-1 Ed. 2.0 b:2014
IEC 60534-7 Ed. 2.0 b:2010