IEC 61189-5-601 Ed. 1.0 b:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
International Electrotechnical Commission , 02/03/2021
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IEC 61189-5-601:2021 specifies the reflow soldering ability test method for components mounted on organic rigid printed boards, the reflow heat resistance test method for organic rigid printed boards, and the reflow soldering ability test method for the lands of organic rigid printed boards in applications using solder alloys, which are eutectic or near-eutectic tin-lead (Pb), or lead-free alloys.
Product Information
Published:
02/03/2021
Pages:
80
File Size:
1 file , 3.3 MB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus
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