IEC 61189-3 Ed. 1.0 b:1997
Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
International Electrotechnical Commission , 04/10/1997
$79.00
$157.00
Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers chemical, mechanical and electrical test methods.
Product Information
Published:
04/10/1997
Pages:
105
File Size:
1 file , 500 KB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus
