IEC 61189-3 Amd.1 Ed. 1.0 b:2006
Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
International Electrotechnical Commission , 08/11/2006
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Product Information
Published:
08/11/2006
Pages:
65
File Size:
1 file , 620 KB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus
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