IEC 61188-6-2 Ed. 1.0 b:2021
Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
International Electrotechnical Commission , 02/04/2021
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IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191-2:2017.
Product Information
Published:
02/04/2021
Pages:
49
File Size:
1 file , 2.1 MB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus
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