IEC 61188-6-1 Ed. 1.0 b:2021
Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards
International Electrotechnical Commission , 02/23/2021
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IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.
Product Information
Published:
02/23/2021
Pages:
63
File Size:
1 file , 5.7 MB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus
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