IEC 61188-5-1 Ed. 1.0 b:2002
Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
International Electrotechnical Commission , 07/12/2002
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Provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.
Product Information
Published:
07/12/2002
Pages:
141
File Size:
1 file , 6.2 MB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus
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