IEC 61188-1-2 Ed. 1.0 b:1998
Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance
International Electrotechnical Commission , 04/29/1998
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The aim in packaging is to transfer a signal from one device to one or more other devices through a conductor. High-speed designs are defined as designs in which the interconnecting properties affect circuit performance and require unique considerations.
Product Information
Published:
04/29/1998
Pages:
83
File Size:
1 file , 470 KB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus
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