IEC 60749-35 Ed. 1.0 b:2006
Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
International Electrotechnical Commission , 07/18/2006
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Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. Provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.
Product Information
Published:
07/18/2006
Pages:
43
File Size:
1 file , 1 MB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus
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