IEC 60749-35 Ed. 1.0 b:2006
Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
International Electrotechnical Commission , 07/18/2006
$95.00
$190.00
Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. Provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.
Product Information
Published:
07/18/2006
Pages:
43
File Size:
1 file , 1 MB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus
Related Documents
IEC 60825-SER Ed. 1.0 b:2023
$900.00
IEC 61823 Ed. 1.0 en:2002
$79.00
IEC 61558-2-7 Ed. 1.0 b:1997
$27.00
IEC 62683-2-3 Ed. 1.0 b:2024
$74.00