IEC 60749-23 Ed. 1.0 b:2004
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
International Electrotechnical Commission , 02/23/2004
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This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way, and is primarily used for device qualification and reliability monitoring.
Product Information
Published:
02/23/2004
Pages:
17
File Size:
1 file , 500 KB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus
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