IEC 60749-22 Ed. 1.0 b:2002
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
International Electrotechnical Commission , 09/12/2002
$95.00
$190.00
Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements
Product Information
Published:
09/12/2002
Pages:
41
File Size:
1 file , 720 KB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus
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