IEC 60749-20 Ed. 1.0 b:2002
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
International Electrotechnical Commission , 09/30/2002
$59.00
$117.00
Applies to semiconductor devices (discrete devices and integrated circuits) - and provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices.
Product Information
Published:
09/30/2002
Pages:
49
File Size:
1 file , 1.7 MB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus
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