IEC 60749-15 Ed. 3.0 b:2020
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
International Electrotechnical Commission , 07/14/2020
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IEC 60749-15:2020 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron.
Product Information
Published:
07/14/2020
Pages:
17
File Size:
1 file , 1000 KB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus
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