IEC 60191-6-5 Ed. 1.0 en:2001
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
International Electrotechnical Commission , 08/27/2001
$26.00
$51.00
Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array the terminal pitch of which is less than or equal to 0,80 mm.
Product Information
Published:
08/27/2001
Pages:
10
File Size:
1 file , 330 KB
Language:
English
Note:
This product is unavailable in Ukraine, Russia, Belarus
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