IEC 60191-6-21 Ed. 1.0 b:2010
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
International Electrotechnical Commission , 08/30/2010
$48.00
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IEC 60191-6-21:2010 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.
Product Information
Published:
08/30/2010
Pages:
28
File Size:
1 file , 420 KB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus
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