IEC 60191-6-20 Ed. 1.0 b:2010
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
International Electrotechnical Commission , 08/30/2010
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IEC 60191-6-20:2010 specifies methods to measure package dimensions of small outline J-lead-packages (SOJ), package outline form E in accordance with IEC 60191-4.
Product Information
Published:
08/30/2010
Pages:
21
File Size:
1 file , 580 KB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus
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