IEC 60191-6-18 Ed. 1.0 b:2010
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
International Electrotechnical Commission , 01/07/2010
$73.00
$145.00
IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger.
Product Information
Published:
01/07/2010
Pages:
40
File Size:
1 file , 1.1 MB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus
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