IEC 60191-6-17 Ed. 1.0 b:2011
Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
International Electrotechnical Commission , 01/27/2011
$117.00
$234.00
IEC 60191-6-17:2011 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.
Product Information
Published:
01/27/2011
Pages:
53
File Size:
1 file , 640 KB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus
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