IEC 60191-5 Ed. 2.0 b:1997
Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
International Electrotechnical Commission , 04/23/1997
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Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. Covers the requirements for tape with bonded integrated circuits (IC) as supplied by a manufacturer to a user.
Product Information
Published:
04/23/1997
Pages:
71
File Size:
1 file , 570 KB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus
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