BS PD IEC TR 63378-1:2021
Thermal standardization on semiconductor packages-Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
BSI Group , 01/11/2022
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BS PD IEC TR 63378-1:2021 PDF
This part of IEC 63378 specifies the terms and definitions that are commonly used for thermal characteristics of BGA and QFP type semiconductor packages, and guidelines to use these thermal characteristics.
Product Information
Published:
01/11/2022
Pages:
24
ISBN:
9780539171525
File Size:
1 file , 2.4 MB
Language:
English
Note:
This product is unavailable in Ukraine, Russia, Belarus
