BS PD IEC TR 62878-2-7:2019
Device embedding assembly technology-Guidelines. Accelerated stress testing of passive embedded circuit boards
BSI Group , 04/01/2019
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BS PD IEC TR 62878-2-7:2019 describes the accelerated stress testing of passive embedded circuitboards. It can be used for screening finished boards, including multilayer and high-densityinterconnection (HDI) boards. These boards are mainly for mobile devices.Cross References:IEC 60194
Product Information
Published:
04/01/2019
Pages:
14
ISBN:
9780539033595
File Size:
1 file , 2.5 MB
Language:
English
Note:
This product is unavailable in Ukraine, Russia, Belarus
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