BS PD IEC TR 61760-3-1:2022
Surface mounting technology-Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method
BSI Group , 10/31/2022
$132.00
$264.00
BS PD IEC TR 61760-3-1:2022 PDF
Surface mounting technology-Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method
Product Information
Published:
10/31/2022
Pages:
30
ISBN:
9780539179361
File Size:
1 file , 2.4 MB
Language:
English
Note:
This product is unavailable in Ukraine, Russia, Belarus
