BS PD IEC TR 60286-7:2019
Packaging of components for automatic handling-Introduction of a bulk blister pack for miniaturized components
BSI Group , 10/29/2019
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This part of IEC 60286 contains information about the introduction of an innovative bulk blisterpacking system for miniaturized components, for example chip type components of size 1005(metric) and smaller. It includes a proposal for standardization of the interface between thepackaging and automatic assembly systems and requirements to the properties of thepackaging.Cross References:IEC 60286-3:2019IEC 61340-5-3:2015IEC 62090:2017IEC 61340-5-1:2016
Product Information
Published:
10/29/2019
Pages:
16
ISBN:
9780539032666
File Size:
1 file , 1.9 MB
Language:
English
Note:
This product is unavailable in Ukraine, Russia, Belarus
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