Provides a guide to an interconnection system for circuit board partitioning, allowing for a modular construction and solderless assembly of the sub-units.Cross References:BS 2011:Part 1.1BS 2011:Part 2.1EaBS 2011:Part 2.1EbBS 2011:Part 2.1FcBS 2011:Part 2.1M BS 5954:Part 2BS 5954:Part 3BS CECC 00015:Part 1IEC 603-2
Product Information
Published:
03/15/1993
Pages:
40
ISBN:
0580210677
File Size:
1 file , 1.1 MB
Language:
English
Note:
This product is unavailable in Ukraine, Russia, Belarus