BS 5909:1980
Method for scale adhesion test for oxygen-free copper
BSI Group , 04/30/1980
$80.00
$160.02
Specifies the principle and method for scale adhesion testing for oxygen-free high conductivity copper, primarily for use in electronic devices involving glass to metal seals or other uses requiring an adherent film of copper oxide.
Product Information
Published:
04/30/1980
Pages:
2
ISBN:
0580112659
File Size:
1 file , 290 KB
Language:
English
Note:
This product is unavailable in Ukraine, Russia, Belarus
