BS 2011-2.1TD:1990
Environmental testing. Tests-Test Td. Solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
BSI Group , 08/31/1990
$47.00
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Procedure for testing the effects of soldering using a solder bath. Applicable only to products designed to withstand short term immersion in molten solder. To be read in conjunction with Part 1.1Cross References: BS 2011:Part 1.1*BS 2011:Part 2.1T*BS 2011:Part 2.1Ta*BS 2011:Part 2.2T*Replaced by BS EN 60068-2-58:1999 but remains current.
Product Information
Published:
08/31/1990
Pages:
16
ISBN:
058018806X
File Size:
1 file , 4.2 MB
Language:
English
Note:
This product is unavailable in Ukraine, Russia, Belarus
