ATIS 0600427.03.2004(S2015)
Multi-Pair Bonding Using Time Division Inverse Multiplexing
The Alliance for Telecommunications Industry Solutions , 09/01/2004
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This document is a detailed specification of the TDIM protocol in sufficient detail to allow development and testing of interoperable implementations for both transmitter and receiver. It includes a Multi-pair synchronization frame format, Bonding Communication Channel (BCC), Byte oriented Dispatching, Hitless addition and removal of pairs, Fast removal of pair upon pair failure, using IEEE 802.3ah (EFM) handshake for pair discovery, parameter negotiation and setup, and an Optional FEC and Interleaver.
Product Information
Published:
09/01/2004
File Size:
1 file , 620 KB
Language:
English
Note:
This product is restricted and cannot be purchased in the following countries Ukraine, Russia, Belarus
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