ASTM F3147-15
Standard Test Method for Evaluating the Reliability of Surface Mounted Device (SMD) Joints on a Flexible Circuit by a Rolling Mandrel Bend (Withdrawn 2024)
ASTM International , 06/01/2015
$33.00
$66.00
1.1This test method covers a means to test a completed Surface Mounted Device (SMD) joint for bond strength and inter-layer stress compatibility
1.2A completed SMD joint includes; SMD (LED, resistor, etc), PTF ink land (typically silver), conductive adhesive (typically silver), staking compound (non-conductive), and encapsulant (non-conductive).
Product Information
Published:
06/01/2015
Pages:
3
File Size:
1 file , 130 KB
Language:
English
Note:
This product is unavailable in Russia, Ukraine, Belarus
